Cao, Li-Ao : rechercher sur Z-Library

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1

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Barrier layer dependence of self-annealing effect in directly electroplated copper films

Xu Wang,, Guang Yang,, Li-Ao Cao,, Xin-Ping Qu,

Année:

2016

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2016

2

[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Study of a single layer ultrathin CoMo film as a direct plateable adhesion/barrier layer for next generation interconnect

Qu, Xin-Ping, Wang, Xu, Cao, Li-Ao, Xu, Wen-Zhong

Année:

2014

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2014

3

[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Effects of colloidal silica on the CMP of Molybdenum in the alkaline slurry

Feng, Hui, Cao, Li-Ao, Feng, Ji-Yu, Qu, Xin-Ping

Année:

2014

Langue:

english

Fichier:

PDF, 357 KB

english, 2014

4

[IEEE 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT) - Guilin, China (2014.10.28-2014.10.31)] 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Investigation of the adhesion properties between COxMOy alloys and porous low-k

Li-Ao Cao,, Hui Feng,, Xu Wang,, Xin-Ping Qu,

Année:

2014

Langue:

english

Fichier:

PDF, 507 KB

english, 2014

5

[IEEE 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT) - Guilin, China (2014.10.28-2014.10.31)] 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Effect of glycine on CMP process of molybdenum

Feng, Hui, Cao, Li-Ao, Qu, Xin-Ping

Année:

2014

Langue:

english

Fichier:

PDF, 511 KB

english, 2014

6

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Direct copper electrodeposition on novel CoMo diffusion barrier

Wang, Xu, Cao, Li-Ao, Qu, Xin-Ping

Année:

2015

Fichier:

PDF, 1.38 MB

2015

7

Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnect

Wang, Xu, Cao, Li-Ao, Yang, Guang, Qu, Xin-Ping

Journal:

Microelectronic Engineering

Année:

2016

Langue:

english

Fichier:

PDF, 2.71 MB

english, 2016

8

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - The oxygen barrier properties of CoxMoy diffusion barrier for Cu interconnect

Li-Ao Cao,, Xin-Ping Qu,

Année:

2016

Langue:

english

Fichier:

PDF, 890 KB

english, 2016